JiXun Electronics Technology Co.,LTD -

JiXun Electronics Technology Co.,LTD

Showing 11 - 15 of 15, total 2 pages [First] [Previous] [Next] [Last]

10l_multilayer_printed_circuit_board
Specification: rigid pcb
Detail: Technical description: layer: 10 material: FR4 High Tg 170 Board thickness: 2.0mm Cooper thickness: 1/1 Oz Surface finished: immersion tin Min through hole: 0.25mm Min line width: 0.12mm Min line ***ce: 0.13mm Speci...

pcb_rigid-flexible_board
Specification: rigid print circuit board
Detail: High layer counts (24+ layers) RoHS Compliance Minimum conductor width/***cing: 0.08/0.08mm (advanced) Minimum drill bit 0.15mm Lead free HAL/HAL/OSP/Immersion silver/Immersion Ni,Au/Immersion Tin/Flash gold/Gold finger C...

multilayer_pcb_printed_circuit_board
Specification: rigid pcb
Detail: Base Material : FR4 Board Thickness : 1.60mm Copper Thickness : 1/1OZ Min. Hole Size : 0.25mm Min. Line ***cing : 5mils Min. Line Width : 5mils

4 layer pcb board
Specification: 4 layer
Detail: 4 layers PCB; Materials: FR-4, Thickness: 1.6mm; Surface processing: immersion Gold; Copper thickness: 35um

multilayer pcb
Specification: 4Layer
Detail: Multilayer PCBs: 4Layer PCB, FR4 1.20mm 1/1OZ, 5/5mils trace, 0.30mm via hole. Immersion Gold, Green


Showing 11 - 15 of 15, total 2 pages [First] [Previous] [Next] [Last]
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